OUR BACKGROUND

CEE-Tech has been established in Malaysia since 2009. With 15 years of experience in the PCB environment, we have strategically partnered with our allies to provide a comprehensive range of PCBs, including Multilayer (up to 28 layers), HDI PCB, Flexible (FPC), Rigid-Flex PCB, Flexible Printed Circuit Assembly (FPCA), IC Substrate, and more.

Our commitment is to establish ourselves as the foremost global provider of Printer Circuit Board (PCB) products and services.

OUR
BACKGROUND

CEE-Tech has been established in Malaysia since 2009. With 15 years of experience in the PCB environment, we have strategically partnered with our allies to provide a comprehensive range of PCBs, including Multilayer (up to 28 layers), HDI PCB, Flexible (FPC), Rigid-Flex PCB, Flexible Printed Circuit Assembly (FPCA), IC Substrate, and more.

Our commitment is to establish ourselves as the foremost global provider of Printer Circuit Board (PCB) products and services.

Cost Effective Pricing at All time

On Time Delivery

Excellent Quality

Professional & Responsive Services

Failure Analysis Capabilities

Cost Effective
Pricing at All time

On Time Delivery

Excellent Quality

Professional &
Responsive Services

Failure Analysis Capabilities

Our Services

Sales & Marketing Development

Technical & Engineering Solutions

Order & Administration

After Sales / Quality Support

Shipping & Logistic Support

Our Products

Our Products

Rigid PCB (MLB, HLC, HDI)

Flexible Printed Circuit Board (FPC)

Rigid Flexible
Circuit Board (R-F)

IC Substrate

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